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Description
Assemble, solder, and rework printed circuit board assemblies (SMT and through-hole) following schematics, BOMs, and IPC standards; inspect and test boards to meet quality and performance specifications.
  • • Inspect and test PCB assemblies for continuity and function; record results.
  • • Place and solder SMT and through-hole components using hand soldering, reflow, or wave processes.
  • • Rework or replace components to correct defects and meet IPC-A-610/IPC-7711 standards.
  • • Clean flux and contaminants from boards using approved solvents and air.
  • • Read schematics, assembly drawings, and BOMs to determine placements, values, and materials.
  • • Label components, reels, and boards for lot control and traceability.
  • • Align components to pads, verify polarity and orientation, and secure before soldering.
  • • Pack finished PCB assemblies in ESD-safe packaging and move to storage or shipping.
  • • Collaborate with supervisors or engineers to plan builds and resolve assembly issues.
  • • Train or guide coworkers on PCB assembly procedures and ESD practices.
  • • Measure and set test points or voltages per specifications to verify operation.
  • • Trim, form, or cut leads and hardware to fit, using cutters, forming tools, and calipers.
  • • Depanel boards and install standoffs or mounting hardware as required.
  • • Maintain build travelers, time logs, and yield or scrap reports.
  • • Follow ESD controls, safety policies, and IPC workmanship standards.
  • • Stage kits, reels, solder paste, stencils, and subassemblies at work areas.
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Tasks & skills: O*NET occupational data (work activities, skills, knowledge). Learn more
Sources & Standards: This site includes information from O*NET by the U.S. Department of Labor, Employment and Training Administration (USDOL/ETA), used under the CC BY 4.0 license. Career Clutch has modified some of this information for student readability. USDOL/ETA has not approved, endorsed, or tested these modifications. O*NET® is a trademark of USDOL/ETA.
Last reviewed: Jan 2026
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